At the wafer level, QSE is partnering with Meyer Burger (a leading Swiss company with global presence) on a Diamond Wire Wafer Cutting, which replaces the classical slurry cutting. As a result, the productivity per machine has more than doubled.
This technology uses an environmentally friendly water based coolant instead of chemical based slurry. In addition, the diamond wire technology uses 25% less compared to the slurry based technology. As a result, the wafer production cost are further reduced, allowing QSE to further reduce the LCOE.